Electron backscatter diffraction (EBSD) is an ideal technique for the characterisation of microstructures in microelectronics samples, providing key information about grain structure, strain and phases on the necessary scale.
In this application note, EBSD has been used to measure solder micro-bumps and wire bonds, providing details about the formation of undesired intermetallic phases and the localisation of strain, both of which could result in device failure.
By downloading this application note you will learn how:
• EBSD can detect unwanted intermetallic compounds in complex microelectronic samples
• Localised strain measured using EBSD can cause wire bond failure
• The Symmetry S2 EBSD detector is ideal for these applications