Research and development of electronic circuitry mounted on plastic substrates are gathering pace with an increasingly large range of products incorporating flexible components. Such circuits are increasingly found in consumer electronics, medical devices, automotive settings and in satellites. In order to assess the structural properties of the electronic components, they have to be analysed while on the plastic substrate without compromising their structural integrity. LayerProbe enables the analyst to separate the contributions of the substrate and the structures and enables measurements of the thickness and composition at high resolution and in a non-destructive manner.
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