The bonding process which occurs in powder based additive manufacturing is not always well understood. The nature of ALM means that the process of bonding is occurring in 3-dimensions, to understand this requires analysis in 3D. The ability to understand the process.
A copper powder was bonded by pressurless sintering. To understand the densification of the powder, grain evolution and how the microstructure of different powder particles interact, the produced metal microstructure was characterised by EBSD in 3D. This shows the growth of grains in one powder particle into another, void locations and if any texture evolves during the process.
3D reconstruction of pressureless sintered copper, shows how the microstructure of separate powder particles bond to form a single piece
Image courtesy of Tim Burnett - University of Manchester
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