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Power Device Failure Analysis using EDS

Metallisation layer connects different components together in semiconductor device and directly affects its performance. Occurrence of defects in metal layers will directly influence device performance. Therefore, failure analysis is crucial to find the cause of the defect and trace it back to the manufacturing process. A large-area Ultim Max 170 EDS detector is ideal for this type of analysis allowing significant throughput rates even when reducing SEM energy.

By downloading this application note, you will learn about:

  • The analysis of defects in semiconductor device metallisation layer
  • Why Ultim Max 170 EDS detector is ideal for the failure analysis of semiconductor devices
  • How AZtecLive software with Tru-Q® technology enables finding the cause of failure in power devices
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